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| 图片 | 型号 | 制造商 | 库存 | 封装 | 描述 | 询价 |
|---|---|---|---|---|---|---|
 |
MC33PF8200DHESR2 |
NXP USA Inc. | 2080 | Tape & Reel (TR) | POWER MANAGEMENT IC I.MX8 PRE-PR |
询价 |
|
MC33PF8200ESESR2 |
NXP USA Inc. | 3565 | Tape & Reel (TR) | POWER MANAGEMENT IC I.MX8 PRE-PR |
询价 |
|
MC33PF8200CXESR2 |
NXP USA Inc. | 3584 | Tape & Reel (TR) | POWER MANAGEMENT IC I.MX8 PRE-PR |
询价 |
|
MC33PF8200CXES |
NXP USA Inc. | 3227 | Tray | IC POWER MANAGEMENT LS1043A |
询价 |
|
MC33PF8200D2ES |
NXP USA Inc. | 3383 | Tray | IC POWER MANAGEMENT |
询价 |
|
MC33PF8200DEES |
NXP USA Inc. | 3235 | Tray | IC POWER MANAGEMENT I.MX8QXP |
询价 |
|
MC33PF8200DFES |
NXP USA Inc. | 2025 | Tray | I.MX8QXP WITH DDR3L |
询价 |
|
MC33PF8200DHES |
NXP USA Inc. | 2418 | Tray | IC POWER MANAGEMENT I.MX8QM |
询价 |
|
MC33PF8200ETES |
NXP USA Inc. | 2017 | Tray | IC POWER MANAGEMENT I.MX8QM |
询价 |
|
MC33PF8200DMES |
NXP USA Inc. | 2833 | Tray | POWER MANAGEMENT IC I.MX8 PRE-PR |
询价 |
|
MC33PF8200DNES |
NXP USA Inc. | 2110 | Tray | POWER MANAGEMENT IC I.MX8 PRE-PR |
询价 |
~ES~56.jpg "MVR5510AMDA0ESR2") |
MVR5510AMDA0ESR2 |
NXP USA Inc. | 2054 | Tape & Reel (TR) | IC PMIC VR5510 ASIL-D |
询价 |
|
MVR5510AMDA6ESR2 |
NXP USA Inc. | 3939 | Tape & Reel (TR) | IC PMIC VR5510 ASIL-D |
询价 |
|
MVR5510AMDAHESR2 |
NXP USA Inc. | 3534 | Tape & Reel (TR) | IC PMIC VR5510 ASIL-D |
询价 |
|
MVR5510AMDA4ESR2 |
NXP USA Inc. | 3852 | Tape & Reel (TR) | IC PMIC VR5510 ASIL-D |
询价 |
|
MVR5510AMDA6ES |
NXP USA Inc. | 2657 | Tray | IC PMIC VR5510 ASIL-D |
询价 |
 |
MCZ33800EK |
NXP USA Inc. | 3731 | Tube | IC ENGINE CTRL SW/DVR 54-SOIC |
询价 |
 |
MC33FS6513CAE |
NXP USA Inc. | 2682 | Tray | SYSTEM BASIS CHIP DCDC 1.5A VCO |
询价 |
|
MC33PF8100A0ESR2 |
NXP USA Inc. | 2216 | Tape & Reel (TR) | POWER MANAGEMENT IC I.MX8 NON-PR |
询价 |
 |
MC34PF8100A0EP |
NXP USA Inc. | 3036 | Tray | IC POWER MANAGEMENT |
询价 |
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