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| 图片 | 型号 | 制造商 | 库存 | 封装 | 描述 | 询价 |
|---|---|---|---|---|---|---|
 |
TC1-200G |
Chip Quik Inc. | 3281 | Bulk | HEAT SINK COMPOUND - HIGH DENSIT |
询价 |
|
8329TFF-50ML |
MG Chemicals | 3802 | Bulk | FAST CURE THERM COND ADH FLOW |
询价 |
|
TG-LH-FBPE-80F-0.75 |
t-Global Technology | 3150 | Bulk | EPOXY POTTING COMPOUND BLACK/YEL |
询价 |
|
GL-20-10 |
Wakefield-Vette | 3966 | Bulk | ULTIMIFLUX GEL 10CC SYRINGE 3.5W |
询价 |
|
TG-LH-FBPE-80-0.75 |
t-Global Technology | 3780 | Box | THERMAL POTTING EPOXY 0.75KG PAC |
询价 |
|
TC4-20G |
Chip Quik Inc. | 3098 | Bulk | HEAT SINK THERMAL COMPOUND - DEE |
询价 |
|
4952G |
Aavid, Thermal Division of Boyd Corporation | 3848 | Bulk | THERMALBOND EPOXY 7OZ PACKET |
询价 |
|
A16872-09 |
Laird Technologies - Thermal Materials | 3603 | Bulk | TPUTTY 403 SYRINGE 30CC |
询价 |
|
A16872-02 |
Laird Technologies - Thermal Materials | 3833 | Bulk | TPUTTY 403 75CC CARTRIDGE |
询价 |
|
TG-NSP80-30CC |
t-Global Technology | 3087 | Bulk | NON-SILICONE PUTTY 30CC GREY |
询价 |
|
TG-A7000-55CC |
t-Global Technology | 3355 | Bulk | SILICONE PUTTY 55CC |
询价 |
|
TC2-50G |
Chip Quik Inc. | 2214 | Bulk | HEAT SINK COMPOUND - GREY ULTRA |
询价 |
|
2590999 |
Bergquist | 2893 | Bulk | LF3800LVO-00-150CC BERGQUIST LIQ |
询价 |
|
TG-NSP35-1LB |
t-Global Technology | 2210 | Box | THERMAL NON-SILICONE PUTTY 1LB |
询价 |
|
65-00-GEL37-0180 |
Parker Chomerics | 2956 | Bottle | THERM-A-GAP GEL 37 3.7 W/M-K DIS |
询价 |
|
2624519 |
Bergquist | 3009 | Can | LIQUIFORM TLF 6000HG 150CC CART |
询价 |
|
A16872-04 |
Laird Technologies - Thermal Materials | 2984 | Bulk | TPUTTY 403 360CC CARTRIDGE |
询价 |
|
65-02-GEL45-0180 |
Parker Chomerics | 3522 | Box | THERM-A-GAP GEL45 180CC EFD SYR |
询价 |
|
65-01-GEL75-0180 |
Parker Chomerics | 3333 | Bottle | THERM-A-GAP GEL 75 7.5 W/M-K DIS |
询价 |
|
TG-NSP80-1LB |
t-Global Technology | 2791 | Bulk | NON-SILICONE PUTTY 1LB GREY |
询价 |
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